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Mousebites?

Former Member

Hello Forum.

 

I am making a 6 layer PCB and one part of the circuit is supposed to be

able to physically break off so it can be de-attached. I though it could be

made with 'mousebites' (don't know if it got another name, but it is just

like the areas between the individual PCB's when panelizing - Example:

http://blogs.oracle.com/spotee/resource/eDAQ_Panel.jpg).

 

My questions is:

 

1. How is this done in Eagle?

2. I have supply-/ground-layers on some inside layers and groundfill on

both top and bottom layers. should I minimize theese aound the

'break-off-area'?

 

Best regards

 

Stg.

 

 

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Parents

  •  

    "Steen" <stg@logos.dk> wrote in message

    news:iqteeg$7p5$1@cheetah.cadsoft.de...

    Hello Forum.

     

    I am making a 6 layer PCB and one part of the circuit is supposed to be

    able to physically break off so it can be de-attached. I though it could

    be

    made with 'mousebites' (don't know if it got another name, but it is just

    like the areas between the individual PCB's when panelizing - Example:

    http://blogs.oracle.com/spotee/resource/eDAQ_Panel.jpg).

     

    My questions is:

     

    1. How is this done in Eagle?

    2. I have supply-/ground-layers on some inside layers and groundfill on

    both top and bottom layers. should I minimize theese aound the

    'break-off-area'?

     

    1- This is just done by "milling and drilling". Normally this is done by the

    manufacturer and is part of the panelizing process, but if you want to make

    panels yourself, you just define the shape by drawing in mill layer, and put

    small holes in the perforated tabs. The pick&place manufacturer knows best

    what sizes you should use.

     

    2- If you do this with mill and drill, the spacing will be taken care of by

    DRC parameters (edge clearance), and tracks will be checked by a DRC.

     

     

     

Reply

  •  

    "Steen" <stg@logos.dk> wrote in message

    news:iqteeg$7p5$1@cheetah.cadsoft.de...

    Hello Forum.

     

    I am making a 6 layer PCB and one part of the circuit is supposed to be

    able to physically break off so it can be de-attached. I though it could

    be

    made with 'mousebites' (don't know if it got another name, but it is just

    like the areas between the individual PCB's when panelizing - Example:

    http://blogs.oracle.com/spotee/resource/eDAQ_Panel.jpg).

     

    My questions is:

     

    1. How is this done in Eagle?

    2. I have supply-/ground-layers on some inside layers and groundfill on

    both top and bottom layers. should I minimize theese aound the

    'break-off-area'?

     

    1- This is just done by "milling and drilling". Normally this is done by the

    manufacturer and is part of the panelizing process, but if you want to make

    panels yourself, you just define the shape by drawing in mill layer, and put

    small holes in the perforated tabs. The pick&place manufacturer knows best

    what sizes you should use.

     

    2- If you do this with mill and drill, the spacing will be taken care of by

    DRC parameters (edge clearance), and tracks will be checked by a DRC.

     

     

     

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