Hi
This is a suggestion that I am al already using and will continue to use
for the future.
For every component that I am using I have defined a stencil cut out for
each pad (only using SMD components).
The stencil cut out is defined in layer 53 (renamed to tStencil) and layer
54 (bStencil).
The advantage of this approach is two fold: (1) the reduction is done once
and for all and does not require manual work from on the stencil supplier.
(2) There are places where the stopmask is open, but the PCB does not
require solder paste. This is typically connectors, and through holes that
are only used for testing in development but not for production.
I wish to share this with Cadsoft, because I hope that the standard
libraries will be updated and upgraded with stencil layer.
Also note how Texas Instruments are beginning to include a 'recommended
stencil' with their recommend foot print.
PS: I have even defined a stencil frame cutout as a special component. This
matches exactly the stencil holding frame that is used in production.
Again, this removes a source of error and manual editing by the company
that produces the stencil.
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