(EAGLE 5.10) I have a 4-layer board I've been working on for months that
last night, as I was finishing the layout, the ground plane polygon on
layer 2 quit pouring properly & instead seemed to connect every pin & via
on the layer w/the only reliefs appearing around drilled holes (not pads)
exclusively. I do see thermals & isolation rings in the layer but the pour
is solid & covers everything. (confirmed via gerber file) Grid is 0.1",
width is .008", pour is solid, spacing is .05", isolate is 0, rank is 1 &
thermals is checked. I'm using the exact same settings on the power planes
(layer 3) which are still pouring just fine. What next? The brd file at
110K is too big to post here but I'll send it to anyone who wants to see
it. Thanks in advance
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