Looking for PowerPAK S08 Footprint (Vishay Si7460 Mosfet)

Jordan Whitley wrote:

Hello all!

I am in desperate need of a footprint for a MOSFET I am designing a

board with, and have been unable to locate one thus far. The specific

part that I am using is a Vishay Siliconix Si7460DP N channel MOSFET in

a PowerPAK SO8 package. Here is a link to the part and the datasheet for

the MOSFET.

 

http://www.newark.com/vishay-siliconix/si7460dp-t1-ge3/n-ch-

mosfet/dp/64R4909?in_merch=Popular%20Products

 

http://www.vishay.com/docs/72126/si7460dp.pdf

 

If anyone could give me a hand with this I would greatly appreciate it.

in the datasheet on page 11 is a "recommended minimum" footprint; that page

is a quote from the app-note 826

(http://www.vishay.com/docs/72286/an826.pdf), in which also the dual pad

footprint is shown - or is the question, how much bigger than "minimum" is

useful?

Gruss, Matthias Dingeldein

--

Guillotinen sind nicht reziprok, aber das macht nix,

die werden eh nur fuer die Hinrichtung verwendet

Hello,

Thank you for taking your time to reply to my question. I am going to be using the single MOSFET package, for a section of my DC/DC boost controller in my switching power supply. I have used some HVSON-8 parts before and the footprint was the recommended one from the datasheet, it was not any bigger than it stated. I am just looking for the actual footprint, I have only done very basic footprints in Eagle and I am not confident in my ability to create a footprint for this pacakge. I am trying to locate someone who has this footprint that would not mind letting me use it. I do not think I need to increase the size of the pads, because I will be heatsinking the device with a large copper pour. Thanks again for your reply, it is greatly appreciated, let me know if I can provide any more information.

Jordan Whitley wrote:

Thank you for taking your time to reply to my question.

you're welcome

I am just looking for the actual

footprint, I have only done very basic footprints in Eagle and I am not

confident in my ability to create a footprint for this pacakge.

I have no experience, too. So I answered with the appnote I found and hoped,

someone else might connect this official data with the best-practice on the

pcb (which I don't know, and which might be different from theory).

Perhaps the package has other, more common names? I remember having trouble

finding a DPAK outline, until i realized its the same as TO252...

Gruss, Matthias Dingeldein

--

Guillotinen sind nicht reziprok, aber das macht nix,

die werden eh nur fuer die Hinrichtung verwendet

Jordan Whitley wrote:

Thank you for taking your time to reply to my question.

you're welcome

I am just looking for the actual

footprint, I have only done very basic footprints in Eagle and I am not

confident in my ability to create a footprint for this pacakge.

I have no experience, too. So I answered with the appnote I found and hoped,

someone else might connect this official data with the best-practice on the

pcb (which I don't know, and which might be different from theory).

Perhaps the package has other, more common names? I remember having trouble

finding a DPAK outline, until i realized its the same as TO252...

Gruss, Matthias Dingeldein

--

Guillotinen sind nicht reziprok, aber das macht nix,

die werden eh nur fuer die Hinrichtung verwendet