Questions about ULP.... automating layout

Gus S. Calabrese wrote:

I reviewed the PDF that covers ULP.... User Language Programs ...... and

I could not see a way to automate creating a layout.

 

I want to create a layout without a schematic.  I am creating a set of

traces that are spaced 25 mils apart.

Each trace is terminated with a via that has a pad size diameter of 75

mils.  In order to get the pads to fit I am staggering them in groups of

four.

Anyway, it would be great if I could write an ULP that would lay down

n traces spaced 25 mils apart.  Each trace would be shorter until the

fifth one which would start getting longer.  Is it possible to write an

ULP that creates a new layout, and then lays down the pads and traces ?

I can figure out the logic of the program... I jsut need the syntax ( if

it exists ) for creating traces and vias.

 

This will result in an adapter pattern that I can use for chips with 25

mil lead spacing.....

what you need is a script and the pad and wire commands.

ULPs have only read access to the board and schematic data.

They can generate command strings or script files and execute them

with the exit command.

so 'help exit', 'help pad' and 'help wire' are your friends.

--

Lorenz

Gus S. Calabrese wrote:

I reviewed the PDF that covers ULP.... User Language Programs ...... and

I could not see a way to automate creating a layout.

 

I want to create a layout without a schematic.  I am creating a set of

traces that are spaced 25 mils apart.

Each trace is terminated with a via that has a pad size diameter of 75

mils.  In order to get the pads to fit I am staggering them in groups of

four.

Anyway, it would be great if I could write an ULP that would lay down

n traces spaced 25 mils apart.  Each trace would be shorter until the

fifth one which would start getting longer.  Is it possible to write an

ULP that creates a new layout, and then lays down the pads and traces ?

I can figure out the logic of the program... I jsut need the syntax ( if

it exists ) for creating traces and vias.

 

This will result in an adapter pattern that I can use for chips with 25

mil lead spacing.....

what you need is a script and the pad and wire commands.

ULPs have only read access to the board and schematic data.

They can generate command strings or script files and execute them

with the exit command.

so 'help exit', 'help pad' and 'help wire' are your friends.

--

Lorenz

I am blundering through the learning process.  I have now found enough information to run this script.......

# Allowed units are mm, mic, mil and in

GRID MIL ;

# Wire  width end1  end2

WIRE 8mil ( 0mil 0mil ) (0mil 1000mil);

WIRE 8mil ( 25 0 ) ( 25 1000 );

change drill diameter 19.68504mil;

via 'test_name'( 0mil  0mil ) 70 octagon  1-16 ;

via 'test_name'( 25mil  100mil ) 70 octagon  1-16 ;

via 'test_name'( 50mil  200mil ) 70 octagon  1-16 ;

via 'test_name'( 75mil  300mil ) 70 octagon  1-16 ;

I am faking the comments using the # sign.

I get an error when I try to change the drill diameter.......

change drill diameter 19.68504mil;

What is an acceptable diameter ?  Do I have to set these in some kind of preferences ?

Update   I discovered some scripting changes that worked.......

# Allowed units are mm, mic, mil and in

GRID MIL ;

# Wire  width end1  end2 ;

layer top ;

WIRE 8mil ( 0mil 0mil ) (0mil 500mil) ;

WIRE 8mil ( 25 100 ) ( 25 500 ) ;

WIRE 8mil ( 50 200 ) ( 50 500 ) ;

WIRE 8mil ( 75 300 ) ( 75 500 ) ;

change drill 10mil ;

change diameter 10mil ;

change shape octagon ;

via 'test_name'( 0mil  0mil )  ;

via 'test_name'( 25mil  100mil )     ;

via 'test_name'( 50mil  200mil )     ;

via 'test_name'( 75mil  300mil )  ;

layer bottom ;

# bottom layer is blue

wire 70mil ( 0mil 0mil ) ( 0mil 1mil ) ;

wire 70mil ( 25mil 100 ) ( 25mil 101mil ) ;

wire 70mil ( 50mil 200mil ) ( 50mil 201mil ) ;

wire 70mil ( 75mil 300mil ) ( 75mil 301mil ) ;

# ==============================

layer top ;

WIRE 8mil ( 100mil 0mil ) (100mil 500mil) ;

WIRE 8mil ( 125 100 ) ( 125 500 ) ;

WIRE 8mil ( 150 200 ) ( 150 500 ) ;

WIRE 8mil ( 175 300 ) ( 175 500 ) ;

change diameter 10mil ;

change shape octagon ;

via 'test_name'( 100mil  0mil )  ;

via 'test_name'( 125mil  100mil )     ;

via 'test_name'( 150mil  200mil )     ;

via 'test_name'( 175mil  300mil )  ;

layer bottom ;

# bottom layer is blue

wire 70mil ( 100mil 0mil ) ( 100mil 1mil ) ;

wire 70mil ( 125mil 100 ) ( 125mil 101mil ) ;

wire 70mil ( 150mil 200mil ) ( 150mil 201mil ) ;

wire 70mil ( 175mil 300mil ) ( 175mil 301mil ) ;