Have a question about CadSoft EAGLE?  Ask our Expert, Jorge!

Hello Jorge,

I am a pcb engineer who is returning to Eagle from Orcad.

Here is my issue...

I have created the following aspects for the generic part:

1.) Symbol

2.) Package

3.) Device

I have connected all the package's pin functions when I created the device.

When I created the package's aspects(symbol,package,device) I set the grid size to 1 mil @ 1 multiple/ Alt:1 mil due to the package size being 4mm X 5mm X .75mm, and the pins being smaller @ 27.55906 mils X 9.84252 mils. 

Now I am having the most frustrating/hair pulling time connecting not only the device's pins but all the other components as well.

What am I doing wrong here that nothing connects and that connections are very difficult to snap? 

This project's ttm debut is in 3 weeks.

Thank you in advance.

On 3/23/2014 11:38 PM, Emjay Ahday wrote:

 

When I created the package's aspects(symbol,package,device) I set the

grid size to 1 mil @ 1 multiple/ Alt:1 mil due to the package size being

4mm X 5mm X .75mm, and the pins being smaller @ 27.55906 mils X 9.84252

mils.

Here's your problem. For the schematic symbol you should always stick to

a 0.1"(2.54mm) grid. For the package you may use whatever is convenient

but for the symbol we very strongly encourage users to stick to a 0.1"

grid. The reason being that all of the components are made to that grid,

and in order for connections to be properly formed you must connect end

points exactly. If you're off by even a fraction of a mil, things won't

connect.

The solution is to fix the symbol so that the pins land on a 0.1" grid,

after that you'll notice that everything connects very easily.

hth,

Jorge Garcia

 

Now I am having the most frustrating/hair pulling time connecting not

only the device's pins but all the other components as well.

What am I doing wrong here that nothing connects and that connections

are very difficult to snap?

 

This project's ttm debut is in 3 weeks.

 

Thank you Jorge for the reply. I truly appreciate it.

So let me make sure I have this straight...

Whenever creating an OCM component of any size I want to be sure to leave the SYMBOL ONLY grid setting @ 0.1 Inch(2.54mm) to make sure the pins snap/connect correctly?

Now to correct my current conundrum...

What is the process to "fix" the symbol?

Are you saying all I have to do is recreate the entire symbol aspect ONLY of the OCM component?

or,

Just change the OCM's symbol's grid to 0.1 Inch(2.54mm)?

I don't understand.

I await your wise counsel Sir.

Thanks again Jorge for I am almost home!

Emjay Ahday

Chuck,

Thank you again for the reply for I appreciate your help immensely.I am working on it now.

From your instructions it appears I will have to enlarge the component's symbol aspect considerably in order for each of the pins to line up to the 0.1" in 1 intersects for proper wire connection. Is this correct?

Remember, I originally created this component's symbol(as well as the package & device) aspect all in 1 mil grid increments as the component is only 4mm X 5mm X 0.75 mm. Being the component is so small I chose to build its symbol aspect in mils. This is before your correction of course.

So by me enlarging the component's symbol size to match with each 0.1" spacing to allow wire connections this will have no bearing on the schematic?

Just to let you know the component has eight pads on each side along with a bottom(gnd) pad to make 17 pads in total.

Spacing each pad to conform to the 0.1" grid will enlarge the component exponentially from what I originally created(in mils).

Thanks again'Chuck for the correction instructions! I love learning(relearning in this case) it is a never ending journey!

Emjay

Muchas Gracias Chuck!

The manual I got was poorly technically written from German hence my reason for coming to the community.

Emjay Ahday

On 03/24/2014 05:35 PM, Emjay Ahday wrote:

Jorge,

A few more questions....

 

For Gerber file generation through Eagle the component's created device

aspect information is used. Is this correct?

 

For example...

The Gerber file must know the exact dimensions of the created package(s)

via one of the created aspects given(symbol,package,device) for

fabrication. Correct?

Emjay,

Not exactly.  The CAM processor creates Gerber files based solely on the

board editor.  That is, it doesn't care about symbols or devices - just

the packages (which may include features destined for a silkscreen) and

the objects (traces, texts, dimensions, etc.) you have laid out in the

board editor.

    - Chuck

On 03/24/2014 04:01 PM, Emjay Ahday wrote:

Thank you Jorge for the reply. I truly appreciate it.

 

So let me make sure I have this straight...

 

Whenever creating an OCM component of any size I want to be sure to

leave the SYMBOL ONLY grid setting @ 0.1 Inch(2.54mm) to make sure the

pins snap/connect correctly?

 

Now to correct my current conundrum...

 

What is the process to "fix" the symbol?

Emjay,

Open the library and edit the symbol of interest.  Then set your grid to

0.1" with:

    grid 0.1in 1;

This sets the grid to 0.1 inches and sets the display of the grid to

every 0.1 in.

Start the move command:

    move

and do a Control-Click on each of the pins that are in your symbol.  The

control-click will cause a pin move to your cursor position and align to

the current grid.  You can also align other features of the symbol, such

as outline wires and text objects as well.

From there, save the library, and open your schematic.  Then do a

Library Update for the library that was changed, or do a

Library-Update-All.  The updated symbol should appear on your schematic,

assuming, of course, that you have already placed one on there.

After you run Nets from the pins of the symbol, you should be able to

move the symbol around have have the nets rubber-band to follow the

movement.  This confirms that the net is connected to the pin.

Switching to the board editor, you should see an air wire from each of

the pads that are connected to a net.  Use the ROUTE command to route

these air wires.  You can use RIPUP to turn the traces back into air wires.

HTH,

    - Chuck

On 03/24/2014 04:01 PM, Emjay Ahday wrote:

Thank you Jorge for the reply. I truly appreciate it.

 

So let me make sure I have this straight...

 

Whenever creating an OCM component of any size I want to be sure to

leave the SYMBOL ONLY grid setting @ 0.1 Inch(2.54mm) to make sure the

pins snap/connect correctly?

 

Now to correct my current conundrum...

 

What is the process to "fix" the symbol?

Emjay,

Open the library and edit the symbol of interest.  Then set your grid to

0.1" with:

    grid 0.1in 1;

This sets the grid to 0.1 inches and sets the display of the grid to

every 0.1 in.

Start the move command:

    move

and do a Control-Click on each of the pins that are in your symbol.  The

control-click will cause a pin move to your cursor position and align to

the current grid.  You can also align other features of the symbol, such

as outline wires and text objects as well.

From there, save the library, and open your schematic.  Then do a

Library Update for the library that was changed, or do a

Library-Update-All.  The updated symbol should appear on your schematic,

assuming, of course, that you have already placed one on there.

After you run Nets from the pins of the symbol, you should be able to

move the symbol around have have the nets rubber-band to follow the

movement.  This confirms that the net is connected to the pin.

Switching to the board editor, you should see an air wire from each of

the pads that are connected to a net.  Use the ROUTE command to route

these air wires.  You can use RIPUP to turn the traces back into air wires.

HTH,

    - Chuck

Chuck,

Thank you again for the reply for I appreciate your help immensely.I am working on it now.

From your instructions it appears I will have to enlarge the component's symbol aspect considerably in order for each of the pins to line up to the 0.1" in 1 intersects for proper wire connection. Is this correct?

Remember, I originally created this component's symbol(as well as the package & device) aspect all in 1 mil grid increments as the component is only 4mm X 5mm X 0.75 mm. Being the component is so small I chose to build its symbol aspect in mils. This is before your correction of course.

So by me enlarging the component's symbol size to match with each 0.1" spacing to allow wire connections this will have no bearing on the schematic?

Just to let you know the component has eight pads on each side along with a bottom(gnd) pad to make 17 pads in total.

Spacing each pad to conform to the 0.1" grid will enlarge the component exponentially from what I originally created(in mils).

Thanks again'Chuck for the correction instructions! I love learning(relearning in this case) it is a never ending journey!

Emjay

Muchas Gracias Chuck!

The manual I got was poorly technically written from German hence my reason for coming to the community.

Emjay Ahday