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EAGLE User Support (English) 0.65mm bga routing
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0.65mm bga routing

Former Member
Former Member over 10 years ago

Hi all. I am working on a project involving a 0.65mm pitch BGA chip. I am having trouble getting the vias under the BGA to a proper size, using the Sunstone PCB design rules. I see restring settings, I temporarily changed those to say drill diameter is 50% of outer layer diameter, I saw no change. I am (for now) using the free version of eagle cad. I found a document explaining proper routing under the BGA, basically putting vias in every other block of four pads.

 

Also, I am using about 50 of the 121 pads, is it possible to do everything on a two layer board?

 

Thank you.

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  • autodeskguest
    0 autodeskguest over 10 years ago

     

    Am 17.07.2015 um 18:21 schrieb Scott Carlson:

    Hi all. I am working on a project involving a 0.65mm pitch BGA chip. I

    am having trouble getting the vias under the BGA to a proper size, using

    the Sunstone PCB design rules. I see restring settings, I temporarily

    changed those to say drill diameter is 50% of outer layer diameter, I

    saw no change. I am (for now) using the free version of eagle cad. I

    found a document explaining proper routing under the BGA, basically

    putting vias in every other block of four pads.

     

     

    For the vias, please check the settings in the Design Rules' Restring

    tab. There are settings that decide about via diameters. Please check

    the minimum value. If you are not sure, pleae contact your board

    manufacturer and ask what is the best combination of drill size and

    via diameter....

     

     

    --

    Mit freundlichen Gruessen / Best regards

    Richard Hammerl

      CadSoft Support -- hotline@cadsoft.de

      FAQ: http://www.cadsoft.de/training/faq/

     

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  • autodeskguest
    0 autodeskguest over 10 years ago

     

    Am 17.07.2015 um 18:21 schrieb Scott Carlson:

    Hi all. I am working on a project involving a 0.65mm pitch BGA chip. I

    am having trouble getting the vias under the BGA to a proper size, using

    the Sunstone PCB design rules. I see restring settings, I temporarily

    changed those to say drill diameter is 50% of outer layer diameter, I

    saw no change. I am (for now) using the free version of eagle cad. I

    found a document explaining proper routing under the BGA, basically

    putting vias in every other block of four pads.

     

     

    For the vias, please check the settings in the Design Rules' Restring

    tab. There are settings that decide about via diameters. Please check

    the minimum value. If you are not sure, pleae contact your board

    manufacturer and ask what is the best combination of drill size and

    via diameter....

     

     

    --

    Mit freundlichen Gruessen / Best regards

    Richard Hammerl

      CadSoft Support -- hotline@cadsoft.de

      FAQ: http://www.cadsoft.de/training/faq/

     

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