Actions
Forum Thread Details
  • State Not Answered
  • Replies 2 replies
  • Subscribers 179 subscribers
  • Views 227 views
  • Users 0 members are here
Related

MK24FN1M0VDC12R Schematic/PCB?

stellarfox

I am currently working on an Arduino-like Microcontroller board, and I'm trying to use a MK24FN1M0VDC12R Microcontroller, I can't find anything I can use for Schematics or PCB.

 

Does anyone know how I can obtain anything like it? It's a 121-XFBGA 8mm x 8mm.

  • 0

    Your NXP micro-controller has "DC" near the end of the part number. This

    specifies a 121-pin 8mm x 8mm BGA package. This will be difficult to solder

    and to design a PCB for. You may need a 6-layer board for this part. Is

    this what you really want? It's also available in a 144-pin LQFP ("LQ")

    package, which would be easier to solder and design for. It is, however,

    larger than the BGA part. I did a quick search on Google and didn't find

    any NXP EAGLE libraries.

    --

    Web access to CadSoft support forums at www.eaglecentral.ca.  Where the CadSoft EAGLE community meets.

     

  • 0 in reply to autodeskguest

    On 11/07/2016 08:11 AM, David Pollum wrote:

    Your NXP micro-controller has "DC" near the end of the part number. This

    specifies a 121-pin 8mm x 8mm BGA package. This will be difficult to solder

    and to design a PCB for. You may need a 6-layer board for this part. Is

    this what you really want? It's also available in a 144-pin LQFP ("LQ")

    package, which would be easier to solder and design for. It is, however,

    larger than the BGA part. I did a quick search on Google and didn't find

    any NXP EAGLE libraries.

     

    I agree with your suggestion to consider the 144-LQFP or 100-LQFP

    package instead of the BGA. Both are available in single-unit quantities

    from DigiKey and Mouser.

     

    Here's a TI doc on the problems of creating a board design for BGAs with

    a 0.65mm ball pitch:

     

    http://processors.wiki.ti.com/index.php/General_hardware_design/BGA_PCB_design/0_65_pitch_BGA_Considerations

     

    Not only is the design with such a device a challenge, but the cost of

    manufacturing such a board may be higher than one might expect. Four to

    six layers, narrow traces, small drills, and possibly microvias will all

    run up the cost of the boards.

     

    The big question for the original poster is whether this is a

    professional design by a designer inexperienced with Eagle, a student

    design for a class, or a hobbyist design for home assembly. I suspect

    it's a hobbyist.

     

    As a hobbyist myself I don't consider this an insult by any means.

    However, I've worked with pros who are experienced hardware designers.

    I've also designed and hand-assembled boards with several surface-mount

    packages down to 0.50mm pitch TQFP and QFN devices using hot air reflow

    techniques. At some point I may attempt a BGA package just for the

    experience, but I'll probably start with something cheap, small, and

    wide pitch (like 1.0mm or 0.8mm). I'd consider an 11x11 ball, 0.65mm

    pitch package to be a risky proposition.