MK24FN1M0VDC12R Schematic/PCB?

Your NXP micro-controller has "DC" near the end of the part number. This

specifies a 121-pin 8mm x 8mm BGA package. This will be difficult to solder

and to design a PCB for. You may need a 6-layer board for this part. Is

this what you really want? It's also available in a 144-pin LQFP ("LQ")

package, which would be easier to solder and design for. It is, however,

larger than the BGA part. I did a quick search on Google and didn't find

any NXP EAGLE libraries.

--

Web access to CadSoft support forums at www.eaglecentral.ca.  Where the CadSoft EAGLE community meets.

Your NXP micro-controller has "DC" near the end of the part number. This

specifies a 121-pin 8mm x 8mm BGA package. This will be difficult to solder

and to design a PCB for. You may need a 6-layer board for this part. Is

this what you really want? It's also available in a 144-pin LQFP ("LQ")

package, which would be easier to solder and design for. It is, however,

larger than the BGA part. I did a quick search on Google and didn't find

any NXP EAGLE libraries.

--

Web access to CadSoft support forums at www.eaglecentral.ca.  Where the CadSoft EAGLE community meets.

On 11/07/2016 08:11 AM, David Pollum wrote:

Your NXP micro-controller has "DC" near the end of the part number. This

specifies a 121-pin 8mm x 8mm BGA package. This will be difficult to solder

and to design a PCB for. You may need a 6-layer board for this part. Is

this what you really want? It's also available in a 144-pin LQFP ("LQ")

package, which would be easier to solder and design for. It is, however,

larger than the BGA part. I did a quick search on Google and didn't find

any NXP EAGLE libraries.

I agree with your suggestion to consider the 144-LQFP or 100-LQFP

package instead of the BGA. Both are available in single-unit quantities

from DigiKey and Mouser.

Here's a TI doc on the problems of creating a board design for BGAs with

a 0.65mm ball pitch:

http://processors.wiki.ti.com/index.php/General_hardware_design/BGA_PCB_design/0_65_pitch_BGA_Considerations

Not only is the design with such a device a challenge, but the cost of

manufacturing such a board may be higher than one might expect. Four to

six layers, narrow traces, small drills, and possibly microvias will all

run up the cost of the boards.

The big question for the original poster is whether this is a

professional design by a designer inexperienced with Eagle, a student

design for a class, or a hobbyist design for home assembly. I suspect

it's a hobbyist.

As a hobbyist myself I don't consider this an insult by any means.

However, I've worked with pros who are experienced hardware designers.

I've also designed and hand-assembled boards with several surface-mount

packages down to 0.50mm pitch TQFP and QFN devices using hot air reflow

techniques. At some point I may attempt a BGA package just for the

experience, but I'll probably start with something cheap, small, and

wide pitch (like 1.0mm or 0.8mm). I'd consider an 11x11 ball, 0.65mm

pitch package to be a risky proposition.