Through Hole Components Question

Am 16.08.2017 um 20:03 schrieb Gary Gates:

I'm new to Eagle and was looking for some help with making a PCB board layout that I will have fabricated by a board manufacturer. The goal for my project that I'm working on was to have several capacitors and resistors connected with traces to two different through-hole components, a 12x2 pin female connector (something like this: https://www.digikey.com/product-detail/en/sullins-connector-solutions/PPPC122LFBN-RC/S7115-ND/810251.)

  and a right angle 3 pin connector (something like this: https://www.digikey.com/product-detail/en/sullins-connector-solutions/PPTC031LGBN-RC/S5439-ND/775897)

I'd like to have the pins of the connectors soldered to through holes where they connect to the traces on the top layer (ideally the only layer) of the board. The plastic of the 12x2 connector should be positioned below the top layer with the pins facing upwards, and the plastic piece of the 3 pin connector should be above the top layer of the board. I've attached a couple pictures of how I have it currently designed in my Eagle board layout.

 

As for my actual questions:

As it is now, I don't have any through holes that I individually placed on the board, just the through-hole components themselves, so if I sent it to a manufacturer, how would it be printed? Do I need to add another layer to the board and through-holes in order to specify more accurately how I want the board to be made, and if so, how would I do this?

 

Thanks in advance!

 

    

 

--

To view any images and attachments in this post, visit:

https://www.element14.com/community/message/227267

 

I'm referring to what you have said:

...fabricated by a board manufacturer..

which means that your THT-connector will be connected through VIAS. That

means that the pads of your device show on the TOP- and the BOTTOM layer

with a connection THROUGH the board. That is normal THT technology

...The plastic of the 12x2 connector should be positioned below the top

layer with the pins facing upwards...

One cannot  place things "below the top layer" That would be in the

"middle" of the board between TOP and BOTTOM layer. I think that  you

actually mean the BOTTOM layer.

If you really want to place a connector on the bottom layer then the

device must be MIRRORED.

So to answer your question about extra layers: not needed.

You must learn to turn on/off individual layers in your layout to check

the design.

--

Mit freundlichen Grüßen / With best regards

Joern Paschedag

Am 17.08.2017 um 11:25 schrieb Joern Paschedag:

Am 16.08.2017 um 20:03 schrieb Gary Gates:

I'm new to Eagle and was looking for some help with making a PCB board layout that I will have fabricated by a board manufacturer. The goal for my project that I'm working on was to have several capacitors and resistors connected with traces to two different through-hole components, a 12x2 pin female connector (something like this: https://www.digikey.com/product-detail/en/sullins-connector-solutions/PPPC122LFBN-RC/S7115-ND/810251.)

  and a right angle 3 pin connector (something like this: https://www.digikey.com/product-detail/en/sullins-connector-solutions/PPTC031LGBN-RC/S5439-ND/775897)

I'd like to have the pins of the connectors soldered to through holes where they connect to the traces on the top layer (ideally the only layer) of the board. The plastic of the 12x2 connector should be positioned below the top layer with the pins facing upwards, and the plastic piece of the 3 pin connector should be above the top layer of the board. I've attached a couple pictures of how I have it currently designed in my Eagle board layout.

 

As for my actual questions:

As it is now, I don't have any through holes that I individually placed on the board, just the through-hole components themselves, so if I sent it to a manufacturer, how would it be printed? Do I need to add another layer to the board and through-holes in order to specify more accurately how I want the board to be made, and if so, how would I do this?

 

Thanks in advance!

 

    

 

--

To view any images and attachments in this post, visit:

https://www.element14.com/community/message/227267

 

 

I'm referring to what you have said:

....fabricated by a board manufacturer..

which means that your THT-connector will be connected through VIAS. That

means that the pads of your device show on the TOP- and the BOTTOM layer

with a connection THROUGH the board. That is normal THT technology

 

....The plastic of the 12x2 connector should be positioned below the top

layer with the pins facing upwards...

One cannot  place things "below the top layer" That would be in the

"middle" of the board between TOP and BOTTOM layer. I think that  you

actually mean the BOTTOM layer.

If you really want to place a connector on the bottom layer then the

device must be MIRRORED.

 

So to answer your question about extra layers: not needed.

You must learn to turn on/off individual layers in your layout to check

the design.

 

 

Well, with my VIAs answer I have misunderstood the question. Joern is

right of course:  when you place a correctly drawn THT part from the

library, all needed things are already included (the drills and solder

pads and all associated masks).

For routing, the layers Top, Bottom, Pads, Vias, Unrouted must be visible.

Everything in the Pads and Vias layer is included by the manufacturer to

the copper in the Top layer as well as to the Bottom layer.  I.e., the

solder pads are drawn in the Pads layer but manufactured in the Top and

Bottom copper.  (Only if you prepare Gerber files or plot films by

yourself, you must remember to include those layers.)

Parts are placed initially on the tPlace layer (on the top side of the

board).  If you need parts on the bottom side, MIRROR them to the bPlace

layer.

Hans

Am 17.08.2017 um 11:25 schrieb Joern Paschedag:

Am 16.08.2017 um 20:03 schrieb Gary Gates:

I'm new to Eagle and was looking for some help with making a PCB board layout that I will have fabricated by a board manufacturer. The goal for my project that I'm working on was to have several capacitors and resistors connected with traces to two different through-hole components, a 12x2 pin female connector (something like this: https://www.digikey.com/product-detail/en/sullins-connector-solutions/PPPC122LFBN-RC/S7115-ND/810251.)

  and a right angle 3 pin connector (something like this: https://www.digikey.com/product-detail/en/sullins-connector-solutions/PPTC031LGBN-RC/S5439-ND/775897)

I'd like to have the pins of the connectors soldered to through holes where they connect to the traces on the top layer (ideally the only layer) of the board. The plastic of the 12x2 connector should be positioned below the top layer with the pins facing upwards, and the plastic piece of the 3 pin connector should be above the top layer of the board. I've attached a couple pictures of how I have it currently designed in my Eagle board layout.

 

As for my actual questions:

As it is now, I don't have any through holes that I individually placed on the board, just the through-hole components themselves, so if I sent it to a manufacturer, how would it be printed? Do I need to add another layer to the board and through-holes in order to specify more accurately how I want the board to be made, and if so, how would I do this?

 

Thanks in advance!

 

    

 

--

To view any images and attachments in this post, visit:

https://www.element14.com/community/message/227267

 

 

I'm referring to what you have said:

....fabricated by a board manufacturer..

which means that your THT-connector will be connected through VIAS. That

means that the pads of your device show on the TOP- and the BOTTOM layer

with a connection THROUGH the board. That is normal THT technology

 

....The plastic of the 12x2 connector should be positioned below the top

layer with the pins facing upwards...

One cannot  place things "below the top layer" That would be in the

"middle" of the board between TOP and BOTTOM layer. I think that  you

actually mean the BOTTOM layer.

If you really want to place a connector on the bottom layer then the

device must be MIRRORED.

 

So to answer your question about extra layers: not needed.

You must learn to turn on/off individual layers in your layout to check

the design.

 

 

Well, with my VIAs answer I have misunderstood the question. Joern is

right of course:  when you place a correctly drawn THT part from the

library, all needed things are already included (the drills and solder

pads and all associated masks).

For routing, the layers Top, Bottom, Pads, Vias, Unrouted must be visible.

Everything in the Pads and Vias layer is included by the manufacturer to

the copper in the Top layer as well as to the Bottom layer.  I.e., the

solder pads are drawn in the Pads layer but manufactured in the Top and

Bottom copper.  (Only if you prepare Gerber files or plot films by

yourself, you must remember to include those layers.)

Parts are placed initially on the tPlace layer (on the top side of the

board).  If you need parts on the bottom side, MIRROR them to the bPlace

layer.

Hans