Why is device footprint on board different to package footprint

Question

I have created a device and in the package editor the pad spacing looks fine, however, when I place the device onto the circuit board, the dimensions look different and the pads are way closer together.

It is definitely the same package because I can right click the device on the board and go Open Package and it opens the package but it looks different. The drill size and diameter size has been set manually in the package for all the pins.

Here is what it looks like in the package editor. Looks fine.

...and here is the footprint when placed on the circuit board, everything is fatter.

Shouldn't they display the same?

Phil

rachaelp · Answer

jltharin wrote:

In DRC, some options can modify the shape of pads

Hi Jltharin,

Those are good points and show some of the things which can cause a discrepancy. You've actually missed one off though, and it's the one that's actually causing the issue in this case. The "Restring" settings actually modify the size of the pads which if you look at the images in the original post you can see that the pads have increased in size in the board. This is because the pads in the library were smaller than the minimum calculation made by the restring setting so it increased them automatically.

Anyway, as this post is over a month old I suspect Philip may have found his answer elsewhere as he's not been back on the thread but it was good to post the answers up for completeness in case anybody stumbles across this thread in future. Thanks!

Best Regards,

Rachael