Thermals on isolated vias

"Grzegorz Zalot" <complex@alpha.pl> wrote in message

news:g2lpl7$qmo$1@cheetah.cadsoft.de...

Hello T.Strothmann !:

...

 

Why argue with it?

 

Me ?????

Well, yes, you wrote "Why ????? This is IMHO best way to create good

boards.". And my opinion was that everybody has his personal preference on

how a good board should look like. My suggestion with the "improved via

control" gives you full flexibility in this respect, and as far as the

discussed problem is concerned.

The user has the control.

 

??????

Again: if you can't handle the described automatic actions in a

"ON-AUTO-OFF" fashion you don't have full control.

It should be possible to set

the VIA characteristics in a way that it 1. disables thermal generation

regardless of other settings, 2. enables them regardless of other

settings, and 3. enables or disables them according to "Global Design

Rules" (note, NOT the DRC). Another nice example for this is the STOP

flag (see "Re: STOP flag, vias with and without stop mask" in

eagle.betatest) - same "ON - AUTO - OFF" scheme here. Once more: if at

all, such modifications need to be controlled by "Global Design Rules",

not by the "Design Rule Check".

 

Yes.

 

It's about time to fix this terrible conceptual flaw!!

 

:-D ! IMHO last time ....

But the shortest way is possibility to disable the stupid global flag for

each polygon separately.

Yes, I agree - but in combination with the "ON-AUTO-OFF" setting of each

individual via!

T.

 

regards

--

Grzegorz Zalot

 

complex ltd.

office tel/fax : +48 32 2505840

mobil : +48 501 301515

 

http://www.complex.org.pl/

"Leo B" <leob001@gmail.com> schrieb im Newsbeitrag

news:g2m6o1$7cl$1@cheetah.cadsoft.de...

Gentlemen,

 

I've only been using Eagle for a few months on some simple two-sided

boards, and I'm not sure I understand all the comments here.  To clarify,

here's my situation:

 

I have a two-sided PCB with a ground plane on both sides  (a wide-band

high-gain video amp).  I use a large number of vias (without thermals) to

stitch the two ground planes together.  I want to use a couple of vias for

ground test points, thus the desire for thermals on these vias only.  It

won't break my design if I can't do it - I can always find a big soldering

gun!   BTW I'm using Eagle 4.16r2.

 

Thanks for all the comments.

 

Leo B.

In short: no individual vias. There's only the global setting in the "DRC".

A workaround may be to specify devices with pads only, and use them as vias.

There's a different level of control for pads, local for each polygon.

T.

"Grzegorz Zalot" <complex@alpha.pl> wrote in message

news:g2lpl7$qmo$1@cheetah.cadsoft.de...

Hello T.Strothmann !:

...

 

Why argue with it?

 

Me ?????

Well, yes, you wrote "Why ????? This is IMHO best way to create good

boards.". And my opinion was that everybody has his personal preference on

how a good board should look like. My suggestion with the "improved via

control" gives you full flexibility in this respect, and as far as the

discussed problem is concerned.

The user has the control.

 

??????

Again: if you can't handle the described automatic actions in a

"ON-AUTO-OFF" fashion you don't have full control.

It should be possible to set

the VIA characteristics in a way that it 1. disables thermal generation

regardless of other settings, 2. enables them regardless of other

settings, and 3. enables or disables them according to "Global Design

Rules" (note, NOT the DRC). Another nice example for this is the STOP

flag (see "Re: STOP flag, vias with and without stop mask" in

eagle.betatest) - same "ON - AUTO - OFF" scheme here. Once more: if at

all, such modifications need to be controlled by "Global Design Rules",

not by the "Design Rule Check".

 

Yes.

 

It's about time to fix this terrible conceptual flaw!!

 

:-D ! IMHO last time ....

But the shortest way is possibility to disable the stupid global flag for

each polygon separately.

Yes, I agree - but in combination with the "ON-AUTO-OFF" setting of each

individual via!

T.

 

regards

--

Grzegorz Zalot

 

complex ltd.

office tel/fax : +48 32 2505840

mobil : +48 501 301515

 

http://www.complex.org.pl/

"Leo B" <leob001@gmail.com> schrieb im Newsbeitrag

news:g2m6o1$7cl$1@cheetah.cadsoft.de...

Gentlemen,

 

I've only been using Eagle for a few months on some simple two-sided

boards, and I'm not sure I understand all the comments here.  To clarify,

here's my situation:

 

I have a two-sided PCB with a ground plane on both sides  (a wide-band

high-gain video amp).  I use a large number of vias (without thermals) to

stitch the two ground planes together.  I want to use a couple of vias for

ground test points, thus the desire for thermals on these vias only.  It

won't break my design if I can't do it - I can always find a big soldering

gun!   BTW I'm using Eagle 4.16r2.

 

Thanks for all the comments.

 

Leo B.

In short: no individual vias. There's only the global setting in the "DRC".

A workaround may be to specify devices with pads only, and use them as vias.

There's a different level of control for pads, local for each polygon.

T.