element14 Community
element14 Community
    Register Log In
  • Site
  • Search
  • Log In Register
  • Community Hub
    Community Hub
    • What's New on element14
    • Feedback and Support
    • Benefits of Membership
    • Personal Blogs
    • Members Area
    • Achievement Levels
  • Learn
    Learn
    • Ask an Expert
    • eBooks
    • element14 presents
    • Learning Center
    • Tech Spotlight
    • STEM Academy
    • Webinars, Training and Events
    • Learning Groups
  • Technologies
    Technologies
    • 3D Printing
    • FPGA
    • Industrial Automation
    • Internet of Things
    • Power & Energy
    • Sensors
    • Technology Groups
  • Challenges & Projects
    Challenges & Projects
    • Design Challenges
    • element14 presents Projects
    • Project14
    • Arduino Projects
    • Raspberry Pi Projects
    • Project Groups
  • Products
    Products
    • Arduino
    • Avnet & Tria Boards Community
    • Dev Tools
    • Manufacturers
    • Multicomp Pro
    • Product Groups
    • Raspberry Pi
    • RoadTests & Reviews
  • About Us
  • Store
    Store
    • Visit Your Store
    • Choose another store...
      • Europe
      •  Austria (German)
      •  Belgium (Dutch, French)
      •  Bulgaria (Bulgarian)
      •  Czech Republic (Czech)
      •  Denmark (Danish)
      •  Estonia (Estonian)
      •  Finland (Finnish)
      •  France (French)
      •  Germany (German)
      •  Hungary (Hungarian)
      •  Ireland
      •  Israel
      •  Italy (Italian)
      •  Latvia (Latvian)
      •  
      •  Lithuania (Lithuanian)
      •  Netherlands (Dutch)
      •  Norway (Norwegian)
      •  Poland (Polish)
      •  Portugal (Portuguese)
      •  Romania (Romanian)
      •  Russia (Russian)
      •  Slovakia (Slovak)
      •  Slovenia (Slovenian)
      •  Spain (Spanish)
      •  Sweden (Swedish)
      •  Switzerland(German, French)
      •  Turkey (Turkish)
      •  United Kingdom
      • Asia Pacific
      •  Australia
      •  China
      •  Hong Kong
      •  India
      • Japan
      •  Korea (Korean)
      •  Malaysia
      •  New Zealand
      •  Philippines
      •  Singapore
      •  Taiwan
      •  Thailand (Thai)
      • Vietnam
      • Americas
      •  Brazil (Portuguese)
      •  Canada
      •  Mexico (Spanish)
      •  United States
      Can't find the country/region you're looking for? Visit our export site or find a local distributor.
  • Translate
  • Profile
  • Settings
Autodesk EAGLE
  • Products
  • More
Autodesk EAGLE
EAGLE User Support (English) Capacitance sensing pads
  • Blog
  • Forum
  • Documents
  • Events
  • Polls
  • Files
  • Members
  • Mentions
  • Sub-Groups
  • Tags
  • More
  • Cancel
  • New
Join Autodesk EAGLE to participate - click to join for free!
Actions
  • Share
  • More
  • Cancel
Forum Thread Details
  • Replies 5 replies
  • Subscribers 177 subscribers
  • Views 388 views
  • Users 0 members are here
Related

Capacitance sensing pads

autodeskguest
autodeskguest over 17 years ago

I'm trying to make some symbols to use as capacitive sensing buttons for use

with a Cypress PSoC Capsense chip. The Cypress application note (AN2292)

says to fill ground around the pads. I can't figure out how to create a

buffer area to keep the polygon from filling right over the pads. Any ideas?

 

 

 

  • Sign in to reply
  • Cancel
Parents
  • autodeskguest
    autodeskguest over 17 years ago

    I guess I wasn't clear. The symbol consists of a through-hole pad (which is

    what the device connects to on the bottom layer), and a polygon around it.

    The polygon has to be made in the top layer only, because that's where the

    touch sensing happens. I can't make it with layer 17, because that would

    create polygons on both top and bottom. For the buttons, I suppose I could

    distort an SMD, but I also need to create W-shaped elements for the

    "slider". If you're curious, here's the application note:

     

    http://download.cypress.com.edgesuite.net/design_resources/application_notes/contents/capacitance_sensing___layout_guidelines_for_psoc_capsense___an2292_12.pdf

     

    "David Moodie" <dgmoodie@onetel.com.cut_this_off> wrote in message

    news:g2qoqd$phh$1@cheetah.cadsoft.de...

    John Giddy wrote:

    LGR wrote:

    I'm trying to make some symbols to use as capacitive sensing buttons for

    use with a Cypress PSoC Capsense chip. The Cypress application note

    (AN2292) says to fill ground around the pads. I can't figure out how to

    create a buffer area to keep the polygon from filling right over the

    pads. Any ideas?

     

    If the pads are made using SMD pads or through-hole pads, any polygon

    drawn around them but named differently from the signals on the pads will

    automatically have an isolation space around the pads.

    If you draw the touch pads using polygons, you will just have to be

    careful how you draw the ground polygon outline so an isolation space is

    left.

    John G.

     

    If using two polygons then the inner polygon needs to have a lower rank

    than the outer. See Help polygon, where there are a few lines on Rank.

    You do not need to take special care about drawing the outer polygon.

    The isolation will be set depending upon the isolation value of the

    polygons, the higher value being used.

     

    cheers

     

    David

     

     

     

    • Cancel
    • Vote Up 0 Vote Down
    • Sign in to reply
    • Cancel
Reply
  • autodeskguest
    autodeskguest over 17 years ago

    I guess I wasn't clear. The symbol consists of a through-hole pad (which is

    what the device connects to on the bottom layer), and a polygon around it.

    The polygon has to be made in the top layer only, because that's where the

    touch sensing happens. I can't make it with layer 17, because that would

    create polygons on both top and bottom. For the buttons, I suppose I could

    distort an SMD, but I also need to create W-shaped elements for the

    "slider". If you're curious, here's the application note:

     

    http://download.cypress.com.edgesuite.net/design_resources/application_notes/contents/capacitance_sensing___layout_guidelines_for_psoc_capsense___an2292_12.pdf

     

    "David Moodie" <dgmoodie@onetel.com.cut_this_off> wrote in message

    news:g2qoqd$phh$1@cheetah.cadsoft.de...

    John Giddy wrote:

    LGR wrote:

    I'm trying to make some symbols to use as capacitive sensing buttons for

    use with a Cypress PSoC Capsense chip. The Cypress application note

    (AN2292) says to fill ground around the pads. I can't figure out how to

    create a buffer area to keep the polygon from filling right over the

    pads. Any ideas?

     

    If the pads are made using SMD pads or through-hole pads, any polygon

    drawn around them but named differently from the signals on the pads will

    automatically have an isolation space around the pads.

    If you draw the touch pads using polygons, you will just have to be

    careful how you draw the ground polygon outline so an isolation space is

    left.

    John G.

     

    If using two polygons then the inner polygon needs to have a lower rank

    than the outer. See Help polygon, where there are a few lines on Rank.

    You do not need to take special care about drawing the outer polygon.

    The isolation will be set depending upon the isolation value of the

    polygons, the higher value being used.

     

    cheers

     

    David

     

     

     

    • Cancel
    • Vote Up 0 Vote Down
    • Sign in to reply
    • Cancel
Children
No Data
element14 Community

element14 is the first online community specifically for engineers. Connect with your peers and get expert answers to your questions.

  • Members
  • Learn
  • Technologies
  • Challenges & Projects
  • Products
  • Store
  • About Us
  • Feedback & Support
  • FAQs
  • Terms of Use
  • Privacy Policy
  • Legal and Copyright Notices
  • Sitemap
  • Cookies

An Avnet Company © 2026 Premier Farnell Limited. All Rights Reserved.

Premier Farnell Ltd, registered in England and Wales (no 00876412), registered office: Farnell House, Forge Lane, Leeds LS12 2NE.

ICP 备案号 10220084.

Follow element14

  • X
  • Facebook
  • linkedin
  • YouTube