I'm laying out a board with a capacitive slider. The slider electrodes use a large footprint. I'd like to be able to route through this footprint - is using a pour the best option?
I'm laying out a board with a capacitive slider. The slider electrodes use a large footprint. I'd like to be able to route through this footprint - is using a pour the best option?
Alexander Farley wrote:
I'm laying out a board with a capacitive slider. The slider
electrodes use a large footprint. I'd like to be able to route
through this footprint - is using a pour the best option?
Unsure of what you are asking but the following read my be appropriate for
you.
http://cache.freescale.com/files/sensors/doc/app_note/AN3863.pdf
Warren
--
Viewed / responded via the newsgroup at
news.cadsoft.de
More information regarding PCB-Based Capacitive Touch Sensing have been explained in below application note from TI
Thanks for the info - I was asking specifically about Eagle though. I understand in general how capacitive pads work, I'm wondering what the best way to do this in Eagle is.
The problem is that if I make a capacitive pad footprint, I can't route through it, which is inconvenient since capacitive pads are usually quite large. If I use a pour, it's less portable (I'd need to manually create a new pour for each design instead of creating a capacitive pad part).