I'm laying out a board with a capacitive slider. The slider electrodes use a large footprint. I'd like to be able to route through this footprint - is using a pour the best option?
I'm laying out a board with a capacitive slider. The slider electrodes use a large footprint. I'd like to be able to route through this footprint - is using a pour the best option?
Thanks for the info - I was asking specifically about Eagle though. I understand in general how capacitive pads work, I'm wondering what the best way to do this in Eagle is.
The problem is that if I make a capacitive pad footprint, I can't route through it, which is inconvenient since capacitive pads are usually quite large. If I use a pour, it's less portable (I'd need to manually create a new pour for each design instead of creating a capacitive pad part).
Thanks for the info - I was asking specifically about Eagle though. I understand in general how capacitive pads work, I'm wondering what the best way to do this in Eagle is.
The problem is that if I make a capacitive pad footprint, I can't route through it, which is inconvenient since capacitive pads are usually quite large. If I use a pour, it's less portable (I'd need to manually create a new pour for each design instead of creating a capacitive pad part).