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place components on bottom layer without mirroring?

Former Member

Hey guys,

I'm sorry for being a noob but every word on the subject I find suggests using the mirror tool.

 

I've created my pcb layout which has zif eprom sockets on the top layer and a DIL28 IC socket which should be underneath the zif socket (slightly offset a little)

So in essence the components are kinda stacked.

 

if I choose mirror it flips the IC socket around which just doesnt seem right to me.

also after trying to mirror the ic socket i would have expected to see the solder pads for it to be on the top but teh solder pads for the zif socket on the bottom.

 

am I being a total idiot?

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  • 0

    I thought it best to accompany my ramblings with a screenshot. lol

     

    So in my mind, the zif sockets are on the top layer (although would be soldered on the bottom layer)

    the 3  DIL IC sockets are offset to the right of each zif socket. those sockets should be on the bottom layer, but soldered on the top layer.

    The switches should all be sat on the top layer and soldered on the bottom.

     

    image

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  • 0

    I thought it best to accompany my ramblings with a screenshot. lol

     

    So in my mind, the zif sockets are on the top layer (although would be soldered on the bottom layer)

    the 3  DIL IC sockets are offset to the right of each zif socket. those sockets should be on the bottom layer, but soldered on the top layer.

    The switches should all be sat on the top layer and soldered on the bottom.

     

    image

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  • 0 in reply to Former Member

    On 02/20/2014 09:17 PM, Brad Holland wrote:

    I thought it best to accompany my ramblings with a screenshot. lol

     

    So in my mind, the zif sockets are on the top layer (although would be

    soldered on the bottom layer)

    the 3  DIL IC sockets are offset to the right of each zif socket. those

    sockets should be on the bottom layer, but soldered on the top layer.

    The switches should all be sat on the top layer and soldered on the

    bottom.

     

    Brad,

     

    Forget about on which side the pins are soldered.  The pads are on both

    the top and bottom layers since the holes are plated through.  Thus,

    when you mirror one of the parts, the only thing that appears to change

    is where the clamp arm is located.

     

    To make it a bit more clear as to what's happening with the mirror, go

    to Options->Set->Misc and make sure the checkbox labeled "Display pad

    names" is turned on.  When the board is viewed, each pad will have the

    pin number in it.  If you also turn off the Drills, Holes, tStop, and

    bStop layers, it will remove some of the clutter on your board.

     

    When deciding whether to mirror a part or not, one should consider from

    which side will the part be installed?  If the ZIF is installed on the

    top of the board, it should NOT be mirrored.  If it is installed on the

    bottom side of the board, it MUST be mirrored.

     

    The easiest example I can think of is to take one of your ZIF sockets

    and set it on the table pins down (top installation).  Note the location

    of pin 1.  Now flip it over horizontally so that the pins are up (bottom

    installation).  Note the location of pin 1.  This is how it's displayed

    in Eagle - viewed from the top down looking through the board.

     

    All in all, it looks like you want the ZIF's installed on the top side

    (not mirrored), and the DIL's installed on the bottom side (mirrored).

    In the image, U15 is properly mirrored, while U11 and U16 are not.

     

    HTH,

        - Chuck