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place components on bottom layer without mirroring?

Former Member

Hey guys,

I'm sorry for being a noob but every word on the subject I find suggests using the mirror tool.

 

I've created my pcb layout which has zif eprom sockets on the top layer and a DIL28 IC socket which should be underneath the zif socket (slightly offset a little)

So in essence the components are kinda stacked.

 

if I choose mirror it flips the IC socket around which just doesnt seem right to me.

also after trying to mirror the ic socket i would have expected to see the solder pads for it to be on the top but teh solder pads for the zif socket on the bottom.

 

am I being a total idiot?

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    Brad Holland wrote:

     

    Hey guys,

    I'm sorry for being a noob but every word on the subject I find suggests

    using the mirror tool.

     

    I've created my pcb layout which has zif eprom sockets on the top layer

    and a DIL28 IC socket which should be underneath the zif socket

    (slightly offset a little)

    So in essence the components are kinda stacked.

     

    yes and no 8-)

     

    If you dont mirror the the bottom parts, the pin assignment on them

    will be mirrored regarding the IC you put into the socket.

    That is you would need to bend the IC pins to top by 180° to connect

    them correctly 8-)

    I can't imagine that is wat you want.

     

     

    if I choose mirror it flips the IC socket around which just doesnt seem

    right to me.

     

    well, see above

     

     

    also after trying to mirror the ic socket i would have expected to see

    the solder pads for it to be on the top but teh solder pads for the zif

    socket on the bottom.

     

    I assume you have a one layer setup? In that case you will have Pads

    only on one side of the board (usualy the bottom side, layer 16 that

    is).

     

     

    am I being a total idiot?

     

    no comment (sorry, couldn't resist)

    --

     

    Lorenz

     

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  • 0

    Brad Holland wrote:

     

    Hey guys,

    I'm sorry for being a noob but every word on the subject I find suggests

    using the mirror tool.

     

    I've created my pcb layout which has zif eprom sockets on the top layer

    and a DIL28 IC socket which should be underneath the zif socket

    (slightly offset a little)

    So in essence the components are kinda stacked.

     

    yes and no 8-)

     

    If you dont mirror the the bottom parts, the pin assignment on them

    will be mirrored regarding the IC you put into the socket.

    That is you would need to bend the IC pins to top by 180° to connect

    them correctly 8-)

    I can't imagine that is wat you want.

     

     

    if I choose mirror it flips the IC socket around which just doesnt seem

    right to me.

     

    well, see above

     

     

    also after trying to mirror the ic socket i would have expected to see

    the solder pads for it to be on the top but teh solder pads for the zif

    socket on the bottom.

     

    I assume you have a one layer setup? In that case you will have Pads

    only on one side of the board (usualy the bottom side, layer 16 that

    is).

     

     

    am I being a total idiot?

     

    no comment (sorry, couldn't resist)

    --

     

    Lorenz

     

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