I have two questions:
1. Some components like terminal blocks and large electrolyte capacitors are supposed to be placed directly on the PCB which means that the pins must be soldered on the bottom layer. When I use the auto router feature, it makes traces both in the top and the bottom layer. Is there a way to tell the auto router feature that all connections to specific components have to be routed in the bottom layer? (What I did as a work around: Draw a rectangle/circle in the packages top-layer to define the size of the component, ran the auto router feature and then removed the temporary rectangles/circles.)
2. When I make VIAs on the board, the DRC gives a clearance error because the top and bottom traces overlap in the VIA-point. This happens even if the VIA is identical to those made by the auto router feature (which don't cause clearance error). What am I doing wrong?
Thanks for any help!