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EAGLE User Support (English) How does one remove non-functional pads in vias?
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Forum Thread Details
  • State Suggested Answer
  • Replies 9 replies
  • Answers 2 answers
  • Subscribers 190 subscribers
  • Views 2722 views
  • Users 0 members are here
  • capture
  • pad
  • discontinuities
  • stack
  • non-functional
  • restring
  • impedance
  • removal
  • via
  • routing
Related

How does one remove non-functional pads in vias?

e14 Contributor
e14 Contributor over 11 years ago

How does one remove non-functional pads in vias?  I’m not finding the requisite check box(es) or other settings. 

I need to minimize the discontinuities in at least the higher frequency paths, want to somewhat shrink the resulting anti-pads on the ground and supply layers to improve current return impedance, and it can often contribute to better routing in the vicinity of vias.

I was hoping to even set it by layer and perhaps set the restring by layer, having it depend upon whether there is a trace connected or not.

The only alternative seems labor-crazy intensive, effectively:

  • Setting normal via restring values and applying the appropriate teardrops to the various layers
  • Minimize the restring values to the smallest NFP values wanted for the board, and
  • apply a circle to each and every capture pad where there is a trace to be connected
  • subsequently approving the circle overlap DRC errors

Please describe a better way…?

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  • e14candies
    0 e14candies over 11 years ago

    what exactly is a: non-functional pads in vias?

     

    I've never heard of such a thing.

    --

    Web access to CadSoft support forums at www.eaglecentral.ca.  Where the CadSoft EAGLE community meets.

     

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  • e14candies
    0 e14candies over 11 years ago

    what exactly is a: non-functional pads in vias?

     

    I've never heard of such a thing.

    --

    Web access to CadSoft support forums at www.eaglecentral.ca.  Where the CadSoft EAGLE community meets.

     

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  • e14 Contributor
    0 e14 Contributor over 11 years ago in reply to e14candies

    Also called a NFP, it is any via capture pad (most often thought of on an inner layer) that does not have an attached trace.  They serve no purpose (see contradictory note) but adversely affect high frequency communications due to their capacitance/inductance, forming an unneeded non-uniformity in the electrical path.  Note: they may serve some purpose if the board gets drilled before lamination, and there is discussion regarding their contribution toward barrel failures one way or the other.  Here are a couple papers and a simple google will yield others:

    https://www.altera.com/en_US/pdfs/literature/an/an529.pdf

    https://www.speedingedge.com/PDF-Files/anatomy%20of%20a%20plated%20hole.pdf

    http://www.circuitinsight.com/programs/53503.html

    http://www.ee-training.dk/announcement/high-speed-via.htm

    ...and many others...

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