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Variants and cream layer

p.wagner

I am using population variants (Version 6.6.0).  One thing I find annoying is that for an unpopulated element no cream layer will be created.  Every change in the population therefore means that my manufacturer does not only get new mounting data (easy), but also a new cream stencil has to be produced (costly).

 

Is there a way to get cream layer 'entries' also for unpopulated parts?

 

Kind regards,

 

Paul

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    On 05/13/2015 08:12 AM, Paul Wagner wrote:

    I am using population variants (Version 6.6.0).  One thing I find

    annoying is that for an unpopulated element no cream layer will be

    created.  Every change in the population therefore means that my

    manufacturer does not only get new mounting data (easy), but also a new

    cream stencil has to be produced (costly).

     

    Is there a way to get cream layer 'entries' also for unpopulated parts?

     

    Paul,

     

    I understand the reasoning behind what Eagle is doing.  I had a case

    where I had two different packages of an IC that overlaid each other

    with the idea that if one package was not available, the board could

    accommodate one that was.  Thus, when populating the board, one would

    not want solder paste on the pads of the package that was not being

    installed since it could leave solder pasted underneath the package that

    /was/ being installed.

     

    As a work around, one should consider generating the board fabrication

    files with no variant selected, then, select an appropriate variant to

    build the BOM.

     

    HTH,

        - Chuck

     

     

    Attachments:
    5287.att1.html.zip
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  • 0

    On 05/13/2015 08:12 AM, Paul Wagner wrote:

    I am using population variants (Version 6.6.0).  One thing I find

    annoying is that for an unpopulated element no cream layer will be

    created.  Every change in the population therefore means that my

    manufacturer does not only get new mounting data (easy), but also a new

    cream stencil has to be produced (costly).

     

    Is there a way to get cream layer 'entries' also for unpopulated parts?

     

    Paul,

     

    I understand the reasoning behind what Eagle is doing.  I had a case

    where I had two different packages of an IC that overlaid each other

    with the idea that if one package was not available, the board could

    accommodate one that was.  Thus, when populating the board, one would

    not want solder paste on the pads of the package that was not being

    installed since it could leave solder pasted underneath the package that

    /was/ being installed.

     

    As a work around, one should consider generating the board fabrication

    files with no variant selected, then, select an appropriate variant to

    build the BOM.

     

    HTH,

        - Chuck

     

     

    Attachments:
    5287.att1.html.zip
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