Have a question about CadSoft EAGLE?  Ask our Expert, Richard! (Archive)

Hi,

    I hope all of you are fine, I have to generate XY data file from the .Brd file  for SMT automated placement. So refer me one ULP. Earlier I had used "Picknplace.ulp".but i dont have it right now from where i can down load it

Thanks in advance.

I am setting up a multilayer board and I'm a bit confused.

I would like to set up four layers.

Top wil be signal

Second will be signal

Third will be power

Fourth will be ground.

I would like to set it up so that I can have blind vias from the top and second  layers to any of the other layers. (and each other)

I am having trouble understanding the syntax to set up the layers and the blind and buried vias.

Also, depending on the way I describe the layers and connections, the vias either go to the top of a layer or they seem to go through to  the other  side of the layer.   I am not sure of the significance of this.    Your help is appreciated.

Thanks,

Joe A.

Richard,

Does element14 have an eagle library for PIC18F*50 series microcontrollers; namely PIC18F14K50. I have a need for a component spec but can't find it in any libraries (even PIC micro). Otherwise, can you tell me where I might find one?

Many Thanks.

    Hello Jskene,

         For 20 pins, you can make footprint by yourself for half an hour. Pay attention: exposed pad has to be connected to ground, so it is the pin, #21. For automatic assembly, you can follow the Atmel's drawing. For manual assembly (prototyping PCB), I usually drill hole (so, it became Through Hole Pin) large enough for my soldering iron tip. I also use low temperature solder to connect it to the Ground Plane, to avoid overheating.

    For manual assembly, it is also good idea to make SMD pads a little bit longer, to make soldering easier.

    If you need real help (not advise), you can reach me by e-mail "levafreidin@yahoo.com" or phone (805)-750-0665 cell.

         Good luck!

              Lev.

Hi Daniel,

maybe it is enough to change the width of the polygon? This affects the thermal reliefs as well. The width of the connecting wires are getting thiker with increasing the polygon's width.

On the other hand you could draw a second polygon with the same signal name over/around the smd and change the width for it. So it only affects this restricted area.

You could also change the Thermals parameter of the polygon. Set it off, and the SMDs will be connected without thermal reliefs.

Hope this helps.

Regards,

Richard

Does anyone know where I can find an Eagle footprint for a QFN-20 3mm x 3mm? The only ones I can find are 4mm x 4mm.

This is for an Atmel ATtiny24A-MMH

Thanks;

JS

HI,

just saw your message here, after answering the same question in german. But here you attached a picture which could help a bit. When you use RATSNEST for calculating the polygons, are the polygons filled? Do they have the name of the signal the should belong to?

It is difficult to give advice here, could you send me the board file via private email to supoprt@cadsoft.de.

So I can take a look into it.

Regards,

Richard

Hi richard,

I´ve got a hand routed layout. Though each net is physically completely connected there are still air-wires left (see attached picture). Ratsnest brings no change. Is there any solution except of routing those air-wires ? Using the Auto-Router is no option - it´s an hf-design.

Thanks in advance

Uwe

Hi Arnauld,

it is not quite correct. You have to use two coordinates: One for selecting the group and setting a reference and the second one in order to specify where to place the group.

It can look like this:

  GROUP ALL;

  MOVE  (C>0 0)  (-7.5 -8.4);

The first coordinate contains C> for Ctrl + right mouse click at location (0 0) for accessing the group.

The secon is the left mous click to place the group.

If you are working with an EAGLE version before 5, you don't need the Ctrl key. Then it would look like this:

MOVE  (>0 0)  (-7.5 -8.4);

Regards,

Richard