I have created a footprint for a SON-6 package, quite small. The datasheet calls for oblong pads 0.28mm wide by 0.75mm long and one end being completely rounded (i.e, r=0.14). I used a polygon with wire width 0 to achieve this as the embedded help file appears to say DRC does not check wire width of polygons used for arbitary pads. However, DRC is throwing up a width error for these smd pads. If I thicken the wire width to fit in with my DRC settings I can't create the smd shape I need. Is this a bug in the software or a bug with the way I'm trying to work? Any feedback other than 'just use rectangular smd pads' is welcome.
Thanks, William