When Material Costs Spike, Engineering Decisions Matter. Silver prices have surged and with them, the cost and risk profile of conventional piezo designs. But what if the solution isn’t about managing volatility… but eliminating dependency altogether?
At TDK, we’re taking a different route:
Replacing silver with copperStabilizing cost structuresIncreasing reliability in humid environments
Our copper-based HAS technology doesn’t just respond to market pressure, it redefines the baseline for performance, durability, and scalability across applications like nano-positioning in semiconductor manufacturing, in medical drug delivery, and in AI infrastructure.
The real question isn’t how to cope with rising silver prices. It’s how to design beyond them.
Check this article for details: Silver price hikes! Don’t worry, TDK has the answer | TDK Electronics - TDK Europe
Read about our Piezo Solutions: Piezo Solutions | TDK Electronics - TDK Europe
Buy now from Farnell: piezo Acoustic Components | Farnell® UK
85 °C is not enough for next-generation DC Link Design!
Power electronics are evolving faster than ever and conventional DC link capacitors are starting to hold engineers back.
At the heart of this shift: wide-bandgap semiconductors (like SiC and GaN) that demand higher power density, elevated temperatures, and ultra-fast switching on next-generation converters.
Traditional film capacitor tech struggles under these conditions. That’s why we developed the ModCap UHP series.
Built around a newly engineered high-temperature dielectric, ModCap UHP delivers:Continuous operation at +105 °C without deratingUp to 20 % higher current density and more compact DC link designsOutstanding thermal stability and reliability in the toughest environments
Whether it’s renewable energy, industrial drives, or SiC power modules, this breakthrough lets designers push performance without compromise.
Want to see how we rethought DC link capacitors for extreme conditions?
The New ModCap Likes It Hot | TDK Electronics - TDK Europe
