85 °C is not enough for next-generation DC Link Design!
Power electronics are evolving faster than ever and conventional DC link capacitors are starting to hold engineers back.
At the heart of this shift: wide-bandgap semiconductors (like SiC and GaN) that demand higher power density, elevated temperatures, and ultra-fast switching on next-generation converters.
Traditional film capacitor tech struggles under these conditions. That’s why we developed the ModCap UHP series.
Built around a newly engineered high-temperature dielectric, ModCap UHP delivers:
Continuous operation at +105 °C without deratingUp to 20 % higher current density and more compact DC link designsOutstanding thermal stability and reliability in the toughest environments
Whether it’s renewable energy, industrial drives, or SiC power modules, this breakthrough lets designers push performance without compromise.
Want to see how we rethought DC link capacitors for extreme conditions?
The New ModCap Likes It Hot | TDK Electronics - TDK Europe
