Making AI servers more powerful isn't just about more powerful processors; it's about more efficient power electronics, more powerful cooling, and more data moving at ever-higher speeds.
At electronicaFair 2026, discover how TDK technologies help build the infrastructure that keeps AI data centers powered, connected and running efficiently.
Power: Efficient, high-density power delivery from grid to chip Thermal & Sensing: Real-time monitoring and control for reliable cooling Connectivity: Advanced optical transceiver solutions for high-bandwidth AI communication
From power delivery and thermal management to the optical links moving massive amounts of data, TDK brings technologies together across the AI data center.
In AI Infrastructure. In Everything, Better.
TDK AI Data Center Infrastructure solutions at electronica 2026 | electronica 2026
Munich | Hall B5, Booth 520
November 10–13
