regarding mosfet configuration

I'm not quite sure I'm understanding your question properly.

The device you link to is a single MOSFET. There are multiple package connections to the source and the drain. On a PCB you would connect all the drain pins together and all the source pins together. The reason for having multiple pins is that the current that the device can handle is so high it is too much for one pin and bond wire by itself [I'm impressed that they can manage 32A continuous with just three source pins, to be honest]. Even if you operate the device at a much lower current, still join the pins together - you'll only achieve the rDSon values in the datasheet if you use the device the way they intend [it won't make all that much difference, but why throw away something you are being given for free].

If you want two MOSFETs in one package, they are available. Make sure that the package will be able to dissipate the heat of the two, though [you'll have to do all your thermal calculations again].

I'm new to this kind of packages. So i had doubt regarding various source pad and drain pad. I have worked basically on through hole mosfet's. So this kind of doubt araised.

The device you link to is a single MOSFET. There are multiple package connections to the source and the drain. On a PCB you would connect all the drain pins together and all the source pins together.

In the PCB design, can you elaborate how to connect all the drain's together and source together.

with regards,

Srinivasan

Personally, I make symbols like this for the schematic, so I can see the pin numbers. But other people probably have other ways of doing it. In this case you've got the complication of the thermal pad underneath and you've got to decide whether 5,6,7,8 and the thermal pad are all one, or whether they are all separate, or whether you put the thermal pad in by hand afterwards. The Eagle experts here should be able to guide you as to the best way to do it with that package. [You might need a new question in the Eagle area.]

Your tracks [source and drain] are going to be areas of copper at these sorts of current levels (I'm asssuming you haven't chosen a 30A MOSFET for switching an amp or two). So the source pins will all fall within the source copper area and the drain pins and heat pad will fall within the drain copper area. Do use a track for the gate, though, because you want to keep the capacitance down (the gate charge figure is high enough already without adding to the load for your controller chip).