OPA569 libary

Question

Evening all

Anybody got a library for a texas inst OPA569 ?

http://www.ti.com/general/docs/lit/getliterature.tsp?genericPartNumber=opa569&fileType=pdf

had a go making it myself but struggling with the heat pad and via's

Steve

rachaelp · Answer

Hi Steve,

Okay this is actually a really common thing, I've done loads of IC's which are similar. Basically in your library part, place the pads for the component legs and the 140 mils x 176 mils thermal area as SMT pads. Give the thermal pad a useful name like EPAD and give it a corresponding pin on the symbol. Usually these are meant to be tied to 0V but check your datasheet. This is all you need to do in your library for this part. Then in your layout you can add polygons and vias for the rest. So for your V+, Output and V- connections you will draw polygons and give them those names so they connect, remembering to turn off thermals in the properties. For the thermal areas add polygons under the IC on both sides of the board with the same name as your EPAD's net name (and on inner layers too if so desired) and then add via's with the drill size specified in the datasheet, again with the same name as your EPAD's net.

You will likely get some DRC warnings about the vias in your pads under the IC, you can approve them so they don't show up again.

Best Regards,

Rachael