Unable to see the copper pour on the PAD though the thermels is off

Question

Hi,

I am designing a power supply PCB I have a polygon covering the PAD of one of the ICs There are several small PADS and a big PAD. Now when polygon on the top of the small pads and have the thermals off I see that the polygon fills only the small PADS completely but there is a problem with the large PAD.

How do I resolve this.

Here is the picture for the same

Thanks and regards.

Siddharth

autodeskguest · Accepted Answer

On 18/06/17 12:19, Siddharth Taunk wrote:

I have one more thing to add.

When I have that perticulaer component on the TOP SIDE why is that it is effecting the PCB on the BOTTOM

You answered that in you previous post. The problem you have is with

objects in the DIMENSION layer. This layer represents edges of the

board, which clearly affects ALL layers.

Why have you got anything in the dimension layer in your component?

niteowl12 · Answer

Look at the Isolate setting on the polygon. I have had it set so high that it wont even make a connection to a pin.

I would also check the layout of the pad itself. There is a check box for thermals there too.

-Jason

autodeskguest · Answer

On 18/06/17 12:37, Siddharth Taunk wrote:

Hi,

Thank you, My bad, I designed the component thinking about the dimension of the particular component, Should I change it to tPlace?
Siddharth

tPlace is probably the layer you intended, yes. It's used for the

silkscreen. There's also tDocu for additional outline segments that you

don't want on the silkscreen (e.g. because they overlap pads)

Unable to see the copper pour on the PAD though the thermels is off

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