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Forum Desoldered Spartan-6 FPGA - Free (gone)
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Related

Desoldered Spartan-6 FPGA - Free (gone)

Jan Cumps
Jan Cumps over 3 years ago

I have desolderd a Spartan-6, to check if I could do it. If you can use it, let me know.
I'll send it from Belgium to any country that has no import/export restrictions, in a normal envelope with plain post.
Free shipping too, if you will use it and post a blog on e14. Else you pay the stamp.

image

It may or may not work. The unsoldering went smooth, but I didn't test the FPGA afterwards.
No rebates Slight smile

Xilinx Spartan-6 LX9
XC6SLX9
CSG324BTVL341
speed grade 2C

Original location and underside:

image

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Top Replies

  • saadtiwana_int
    saadtiwana_int over 3 years ago +5
    Nice work! Coincidentally just yesterday I desoldered a Xilinx Spartan-3 FPGA, a TI DSP and an Arm9 processor. All from an old scrap board at work. My colleague has bought a new Hakko hot air rework station…
  • Jan Cumps
    Jan Cumps over 3 years ago in reply to dang74 +3
    I purchased a Weller reflow set
  • Jan Cumps
    Jan Cumps over 3 years ago +3
    A little bit of background: The FPGA is from this defunct CISCO NIM -1MFT-T1/E1 WAN/Voice interface module. I'm using the board to practice reflow techniques. It also has other useful components. A…
Parents
  • saadtiwana_int
    saadtiwana_int over 3 years ago

    Nice work! Coincidentally just yesterday I desoldered a Xilinx Spartan-3 FPGA, a TI DSP and an Arm9 processor. All from an old scrap board at work. My colleague has bought a new Hakko hot air rework station for the lab and I used these as a test. With a bit of practice, I was able to remove the ICs and clean the pads with decent results. I didn't try to put them back because I had no way to re-ball the components. For that, to my knowledge, one has to use bga balls and a stencil. I had neither of those. Probably should buy some for practice.

    My new year resolution for 2023 would be to practice more on scrap boards with BGA package components.

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  • saadtiwana_int
    saadtiwana_int over 3 years ago

    Nice work! Coincidentally just yesterday I desoldered a Xilinx Spartan-3 FPGA, a TI DSP and an Arm9 processor. All from an old scrap board at work. My colleague has bought a new Hakko hot air rework station for the lab and I used these as a test. With a bit of practice, I was able to remove the ICs and clean the pads with decent results. I didn't try to put them back because I had no way to re-ball the components. For that, to my knowledge, one has to use bga balls and a stencil. I had neither of those. Probably should buy some for practice.

    My new year resolution for 2023 would be to practice more on scrap boards with BGA package components.

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