Is that the trace width or something else?
Hi Krishna.
They are most likely signal and power traces (the power traces being the thicker ones).
The specific part datasheet will indicate what those pads represent, but the thick traces look destined for the power plane(s).
How much width should be the power traces be? Is there only the change in trace width or something else? So the thinner ones would be smaller trace width compared to the thicker one. Am I right sir?
Hi Krishna,
In general but especially in this case you'd need to follow the datasheet, it's likely prescriptive in that area unless you wish to experiment and affect manufacturability/reliability etc (and probably you don't since these parts are expensive). And then in production it may need to be tweaked further, but the datasheet would be the starting point.
Hi Krishna,
In general but especially in this case you'd need to follow the datasheet, it's likely prescriptive in that area unless you wish to experiment and affect manufacturability/reliability etc (and probably you don't since these parts are expensive). And then in production it may need to be tweaked further, but the datasheet would be the starting point.
Hi Krishna,
The documentation needs to be followed to the fraction of a mil, unless you've got other knowledge about your particular PCB processes that you need to follow (some orgs will have their own guidelines from the manufacturing requirements they need to follow, so you'd need to check in your organisation).
It's best to read the entire doc, since it's critical, and also you could download Gerber files for any reference design for that chip/package (or ask the manufacturer for these) and examine the measurements using any Gerber viewer. This applies to power and signal traces at the chip, and then beyond that you'd need to follow the signal trace requirements for whatever signal standard you're following etc.