Welcome to 8ULP SOM
The 8ULP SOM is a compact (43mm x 36mm), ultra-low power, peripheral-rich, compute module, designed for integration onto custom OEM hardware.
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Technical Specification

The NXP i.MX 8ULP device on this SOM is architected for optimal power efficiency, with separated processing domains, e.g. Application domain with two ArmRegistered CortexRegistered-A35 cores plus 3D/2D GPUs (plus comprehensive Linux enablement for rich GUI applications) Real Time domain with Arm Cortex-M33F core for real-time performance, plus Cadence Fusion F1 DSP core for low-power audio/voice use cases. LPAV domain (Low Power Audio Video) with a Cadence Tensilica HiFi 4 DSP core for advanced audio, ML and sensor applications.

An EdgeLock Security Enclave and μPower Manager include RISC-V cores to manage advanced security features and govern over 20 different power mode configurations across the processing domains. Together with the onboard NXP PCA9460B PMIC, exceptional energy efficiency is achieved.

Memory resources include OCRAM (896 KB), x32bit LPDDR4X DDR (2 GB), 8bit PSRAM (8 MB), eMMC 5.1 flash (32GB) and 8bit SPI NOR flash (4 MB).

Board-to-board interface is via two 100pin (0.4 mm pitch) connectors that can accommodate different stacking heights and have mating connectors from both Samtec and TE Connectivity.

The compact SOM dimensions, energy-efficient multi-processor architecture, EdgeLock security, graphic capabilities and rich peripheral mix, all add-up to a versatile intelligent edge solution.

Click on the images to enlarge

Bottom View
Bottom View
Left Bottom View
Left Bottom View
Top View SOM
Top Image
Front View SOM
Front Image
SOM Dimensions
SOM Dimensions
Left Angle SOM
Left Angle SOM

Features

  • NXP i.MX 8ULP Processor
    • 2x Arm Cortex A35 (800 MHz)
    • 1x Arm Cortex M33 (216 MHz)
    • 1x HiFi 4 DSP (600 MHz)
    • 1x Fusion DSP (200 MHz)
    • 1x 3D/2D-GPU (317 MHz) (OpenGL ES 3.1, Vulkan, OpenVG 1.1, OpenCL 2.x)
  • Memory
    • 2 GB LPDDR4X (x32bit)
    • 32 GB eMMC Flash memory (x8bit)
    • 896 KB OCRAM
    • 8 MB Octal SPI PSRAM (x8bit)
    • 4 MB Octal SPI NOR Flash (x8bit)
  • PHY interfaces on B2B connectors
    • 2x USB 2.0 OTG ports incl PHY
    • 1x MIPI DSI LCD interface (4-lane)
    • 1x MIPI-CSI Camera Interface (2-lane)
  • Peripheral interfaces on B2B connectors can be configured for up to:
    • 2x SDHC
    • 1x 10/100 ETH (with IEEE1588)
    • 8x LPUART, 5x LPSPI, 7x LPI2C
    • 1x CAN/CAN-FD
    • 4x I2S, 4x DMIC/SPDIF
    • 2x DAC (12bit), 2x ADC (12bit)
    • 2x Analog Comparators
  • Expansion, Power, Mechanical
    • 2x 100pin (0.4mm pitch) B2B connectors Samtec ST4, requires SS4 on OEM board
    • SOM DC supply in : 5V
    • VDD_Buffer port D : 2.5V / 3.3V / 5.0V
    • VDD ports E and F : 1.8V / 2.5V / 3.3V
    • Operating Temperature: -40C~+85°C
    • 43mm x 36mm form factor

Technical Documents

Product Brief

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